UPILEX-FOAM is an open-cell polyimide foam, which offers very good thermal and acoustic insulation. UPILEX-FOAM has a very high heat and cryogenic resistance and very low flammability and low outgassing.

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| Aircraft | Aerospace | Industrial |
|---|---|---|
| Thermal and acoustic fuselage blankets, air-conditioning duct insulation, vibration damping for aircraft fuselage. | Cryogenic insulation for fuel tanks on major rocket propulsion systems, thermal insulation on the louvers of communications satellites. | Heat and acoustic insulation for nuclear power plants, vessels and automobile engines. |

High Temperature Artificial Cork
UPIBOARD FB101 is polyimide board having light weight and high temperature properties.




| Item | Typical Values | Unit | Test Method |
|---|---|---|---|
| Density | 0.6 | g/cc | ASTM D3574(A) |
| Tensile Strength | 6 | Mpa | ASTM D638 |
| Compression Modulus | 160 | Mpa | DSC Analysis(N2) |
| Tg | 300 | ![]() |
DSC Analysis(N2) |
| Thermal Conductivity | 0.09 | W/m·k | ASTM C518 |
| Dielectric Constant | 2.5 | 1MHz | ASTM D149 |
| Breakdown Voltage | 3.5 | kv/mm | ASTM D149 |
Polyimide foam chips with size ranging from 1mm to 30mm diameter.







| Item | Typical Values | Unit | Test Method |
|---|---|---|---|
| Density | <10 | kg/m3 | ASTM D 3574 (A) |
| Tg | 400 | ![]() |
DSC Analysis(N2) |
| 5% Weight Loss Temp. | 570 | ![]() |
TGA Analysis(Air) |
| Thermal Conductivity | 0.035 | W/m·K | ASTM C 518 |
| Flammability | V-0 quite | - | |
| Oxygen Index | 51 | % | ASTM D 2863 |
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